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Tpcm™ 5810 – 0.25mm | Laird
Non-Silicone Phase Change TIM
£0.00
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- Low total thermal resistance (0.013°C-in2/W at 50 psi)
- inherently tacky and easy-to-use – no adhesive required
- High reliability
15 Sheets In Stock
Description
The Tpcm™ 580 Series is a high-performance thermal phase change material (PCM) designed to meet the thermal reliability and price requirements of high-end thermal applications. The Series is inherently tacky, flexible and exceptionally easy-to-use.
The Tpcm 580 Series is available in four thicknesses: 0.003” (Tpcm 583), 0.005” (Tpcm 585), 0.008” (Tpcm 588), 0.010” (Tpcm 5810) and 0.016” (Tpcm 5816). At temperatures above its transition temperature of 50°C (122°F), the Tpcm 580 Series begins to soften and flow, filling the microscopic irregularities of the components it comes into contact with.
The result is an interface with minimal thermal contact resistance. Due to the gradual change in viscosity (softening), it minimises migration (pump-out). The Tpcm 580 Series can be supplied as cut parts in strips and rolls with top tabbed liners for easy application.
The top tabbed liner can be removed immediately or provide a protective cover during shipping, and can be removed at assembly. It can also be supplied in sheets and custom die-cut configurations; and meets all environmental requirements including RoHS.
Benefits
- The Series is inherently tacky, flexible and exceptionally easy-to-use.
- Provides high value price / performance point
- Meets all environmental requirements including RoHS
Features
- Low total thermal resistance (0.013°C-in2 /W at 50 psi)
- Inherently tacky and easy-to-use – no adhesive required
- High reliability
Recommended Uses
- Microprocessors, Chipsets, Graphic processing chips, Custom ASICS.
Specifications
| Properties | Tpcm™ 5810 |
|---|---|
| Construction & composition | Non-reinforced film |
| Colour | Grey |
| Thickness | 0.010” (0.25 mm) |
| Density | 2.87 g/cc |
| Operating temperature range | -40°C to 125°C (-40°F to 257°F) |
| Phase change softening temperature | 50°C (122°F) |
| Thermal resistance 10 psi | 0.020°C-in2 /W (0.13°C-cm2 /W) |
| Thermal resistance 20 psi | 0.016°C-in2 /W (0.10°C-cm2 /W) |
| Thermal resistance 50 psi | 0.013°C-in2 /W (0.08°C-cm2 /W) |
| Thermal conductivity | 3.8 W/mK |
| Volume resistivity | 3.0 x 1012 ohm-cm |
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