LOADING
Therm-a-Gap G579 – 1.5mm | Parker Chomerics
21/11/2023
Bergquist Gap Pad TGP 1000VOUS – 0.5mm | Henkel
22/11/2023
Therm-a-Gap G579 – 1mm | Parker Chomerics
Reinforced Silicone Gap Filler
£0.00
To get an instant quote for your custom parts, please select your currency and follow steps 1 to 4.
- Soft and compliant gap filler
- Thermal conductivity = 3.0 W/ mK
- Vibration dampening
3 Sheets In Stock
Description
Parker Chomerics THERM-A-GAP™ G579 is a thermally conductive gap filler pad designed to provide efficient heat transfer in electronic devices. With a thermal conductivity of 3.0 W/m-K, it ensures effective heat dissipation. Its low hardness, with a Shore 00 rating of 30, offers excellent conformability to uneven surfaces. The material composition includes a woven glass carrier, providing durability without the need for pressure-sensitive adhesive (PSA). It operates within a temperature range of -67°F to +392°F (-55°C to +200°C), making it suitable for a wide range of applications. Additionally, it meets UL 94 V-0 flammability standards and RoHS compliance. This gap filler pad is ideal for applications requiring high thermal performance and flexibility, such as in automotive electronics, telecommunications, and consumer electronics.
Benefits
- Ultra low deflection force
- High tack surface reduces contact resistance
Features
- Vibration dampening
- Thermal conductivity = 3.0 W/mK
- Soft and compliant gap filler
Recommended Uses
- Telecommunications equipment
- Consumer electronics
- Automotive electronics (ECUs)
- LEDs, lighting
- Power conversion
- Power semiconductors
- Desktop computers, laptops, servers
- Handheld devices
- Memory modules
Typical Physical Properties
| Property (unit) | Test Method | Therm-a-Gap G579 |
|---|---|---|
| Colour | Visual | Pink |
| Binder | - | Silicone |
| Specific Gravity | ASTM D792 | 2.9 |
| Propertey | Test Method | Therm-a-Gap G579 |
|---|---|---|
| Percent Deflection @ Various Pressures (0.125 in thick sample) | % Deflected | ASTM C165 MOD (0.125 in “G” Type, 0.50 in dia probe, 0.025 in/min rate) |
| @5 psi (34kPa) | 22 | ASTM C165 |
| @10 psi (69 kPa) | 33 | ASTM C165 |
| @25 psi (172 kPa) | 55 | ASTM C165 |
| @50 psi (345 kPa) | 68 | ASTM C165 |
Thermal Properties
| Property (unit) | Test Method | Therm-a-Gap G579 |
|---|---|---|
| Thermal Conductivity, W/m-K | ASTM D5470 | 3 |
| Thermal Impedance, °C-in2 /W (°C-cm2 /W) @ 10 psi, @ 0.04 in (1 mm) thick, “G” version only | ASTM D5470 | 0.7 (4.5) |
| Heat Capacity, J/g-K | ASTM E1269 | 1 |
| Coefficient of Thermal Expansion, ppm/K | Chomerics | 150 |
Electrical Properties
| Properties | Test Method | Therm-a-Gap G579 |
|---|---|---|
| Dielectric Strength, Vac/mil (kVac/mm) | Chomerics | 200 (8) |
| Volume Resistivity, ohm-cm | ASTM D149 | 10¹⁴ |
| Dielectric Constant @ 1,000 kHz | ASTM D257 | 8.0 |
| Dissipation Factor @ 1,000 kHz | ASTM D150 | 0.010 |
Regulatory Properties
| Property | Test Method | Therm-a-Gap G579 |
|---|---|---|
| Flammability Rating | UL 94 | V-0 |
| RoHS Compliant | Yes | Chomerics Certification |
| Outgassing, % TML (% CVCM) | ASTM E595 | 0.19 (0.06) |
| Storage Conditions, °F (°C) @ 50% Relative Humidity | Chomerics | 50 to 90 (10 to 32) |
Materials Direct
Precision cut technical materials fast
We’re available to assist you for your next project
A division of Universal Science UK
www.universal-science.com
Related products
-
Select optionsBergquist Sil Pad TSP 900 – 0.18mm | Henkel
£0.00 SKU: 93879- Thermal impedance: 1.13ºC-in2/W @ 50 psi
- Original Sil-Pad material
- Excellent mechanical and physical characteristics
-
Select options
UniGap 3000™ – 2.5mm | Universal Science™
£0.00 SKU: 93492- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
-
Select options
UniGap 6000™ – 3.5mm | Universal Science™
£0.00 SKU: 93507- Ceramic filled gap filling pad
- Thermal conductivity = 6.0W/mK
- Compliant surfaces on both sides function to reduce interfacial thermal resistance
Reviews
There are no reviews yet.