Bergquist Sil Pad TSP K1300 – A1 – 0.15mm | Henkel

Description

The Bergquist SIL PAD® TSP K1300 is a high-performance thermally conductive insulator designed to provide efficient heat dissipation and electrical insulation for a wide range of electronic applications. Featuring a Kapton® MT polyimide base, this advanced thermal pad combines high mechanical strength with excellent thermal conductivity of 1.3 W/m·K, ensuring effective heat transfer from power components to heat sinks while maintaining robust electrical isolation with a dielectric breakdown voltage of 6,000 VAC. Its low thermal resistance of 0.2°C-in²/W minimizes heat buildup, preventing overheating and enhancing long-term device performance.

Engineered for durability, reliability, and cost-efficiency, the SIL PAD® TSP K1300 serves as an ideal replacement for fragile ceramic insulators like Beryllium Oxide and Alumina, significantly reducing breakage and associated costs. Its thin 0.15 mm profile makes it highly adaptable to space-constrained designs, while its excellent cut-through resistance ensures mechanical stability during installation and operation. Designed to meet the demanding thermal management needs of power supplies, automotive electronics, industrial equipment, and consumer devices, the TSP K1300 thermal insulator provides a long-lasting, high-performance solution for applications requiring both efficient heat dissipation and superior electrical isolation.