Bergquist Sil Pad TSP 900 – A1 – 0.18mm | Henkel

Description

The BERGQUIST® SIL PAD® TSP 900 is a high-quality thermal interface material (TIM) designed to provide efficient heat dissipation and electrical insulation in electronic assemblies. Made from silicone rubber reinforced with fiberglass, it offers excellent durability, mechanical strength, and flame resistance, making it a great choice for applications where reliable thermal management is essential. The naturally conformable surface ensures good contact between components and heat sinks, improving heat transfer while maintaining electrical isolation. Over time, its thermal resistance actually improves, ensuring long-term performance and reliability in demanding environments.

With a thermal conductivity of 0.9 W/m·K and low thermal impedance (1.13°C-in²/W at 50 psi), the SIL PAD® TSP 900 effectively reduces heat buildup in power electronics, automotive modules, and motor control systems. The fiberglass reinforcement provides excellent cut-through resistance, preventing damage during installation or operation. Additionally, it meets UL 94 V-0 flammability standards, ensuring enhanced safety and compliance for use in critical applications. Whether you’re working with power semiconductors, motor drives, or power supplies, this thermal pad delivers consistent, high-performance heat dissipation while keeping electrical components safely insulated.

Adhesive on One Side