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5519 Thermal Interface Pad – 0.5mm | 3M™
Thermally Conductive Silicone Interface Pad
£0.00
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- Very high thermal conductivity and good electrical insulation properties
- Good softness and conformability even to non-flat surfaces
- Good electrical insulation properties
2 Sheets In Stock
Description
3M™ Thermally Conductive Silicone Interface Pad 5519 is a high-performance thermal interface material engineered to efficiently manage heat in electronic devices. This pad is made from a soft, conformable silicone elastomer that is filled with thermally conductive ceramic particles, providing exceptional thermal conductivity of 4.9 W/m-K. It is designed to bridge the thermal gap between heat-generating components like processors, power supplies, and heat sinks or other cooling devices, ensuring efficient heat dissipation and preventing overheating.
Benefits
- High Thermal Conductivity
- Conformability
- Electrical Insulation
Features
High Thermal Conductivity
- Ensures efficient heat transfer from heat-generating components to cooling devices.
Conformable and Soft
- Adapts to uneven surfaces, improving thermal contact and reducing thermal resistance.
Electrical Insulation
- Offers excellent dielectric strength, protecting sensitive electronic components.
Flame Retardant
- Meets UL 94 V-0 standards, providing enhanced fire safety.
Slight Tackiness
- Allows for easy pre-assembly and improved wettability for better thermal conductivity.
Recommended Uses
- Integrated Circuit (IC) Packaging: Facilitates heat conduction between ICs and heat sinks.
- Heat Sink Interfaces: Improves thermal management between heat sinks and electronic components.
- Chip-on-Film (COF) Heat Conduction: Enhances heat transfer in COF applications.
- LED Board Thermal Interface: Manages heat dissipation in LED modules.
- High-Definition Television (HDTV) ICs: Assists in thermal regulation of ICs in HDTVs.
- General Gap Filling in Electronic Devices: Provides thermal management in various electronic applications.
Physical Properties
| Property | Value |
|---|---|
| Color | Gray |
| Base resin | Silicone |
| Thickness | 0.5 – 2.0mm* |
| Primary Filler Type | Ceramic |
| Product Liner | PET Film Liner |
Mechanical Properties
| Property | Method | Value |
|---|---|---|
| Thermal Conductivity (W/m-K) | ASTM D5470 | 5 W/m-K |
| Density (g/cm³ , @ 25°C) | ASTM D6111 | 3.1 |
| Operating Temperature Range | 3M test method | -50°C to 140°C |
| Hardness Shore 00ᵇ | Modified ASTM D2240 | 70 ~ 80 |
| UL Flame Classᶜ | UL94 | V-0 |
| Dielectric Breakdown | Modified ASTM D149 (3M test method) | 2 kV/mm |
| Volume Resistivity | ASTM D257 | 1.7 x 10¹⁴ Ohms |
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