instant checkout and fast delivery!
business day after payment is received
Schedule' orders. Apply for a credit account HERE
Manufacturer
Type
Product Name
Thicknesses
Thermal Conductivity
Base
Adhesive
Liners
Colour
show blocks helper
Manufacturer
Type
Product Name
Thicknesses
Thermal Conductivity
Base
Adhesive
Liners
Colour
Showing 841–852 of 991 results
-
Select options- 2.7 W/m K thermal conductivity
- Low pressure versus deflection characteristics
- Excellent surface wetting for low contact resistance
-
Select options
- 2.7 W/m K thermal conductivity
- Low pressure versus deflection characteristics
- Excellent surface wetting for low contact resistance
-
Select options
- 5 W/mK thermal conductivity
- Minimizes board and component stress
- Low pressure versus deflection
-
Select options
- 5 W/mK thermal conductivity
- Minimizes board and component stress
- Low pressure versus deflection
-
Select options
- 5 W/mK thermal conductivity
- Minimizes board and component stress
- Low pressure versus deflection
-
Select options
- 5 W/mK thermal conductivity
- Minimizes board and component stress
- Low pressure versus deflection
-
Select options
- 5 W/mK thermal conductivity
- Minimizes board and component stress
- Low pressure versus deflection
-
Select options
- 5 W/mK thermal conductivity
- Minimizes board and component stress
- Low pressure versus deflection
-
Select options
- 5 W/mK thermal conductivity
- Minimizes board and component stress
- Low pressure versus deflection
-
Select options
- 5 W/mK thermal conductivity
- Minimizes board and component stress
- Low pressure versus deflection
-
Select options
- 5 W/mK thermal conductivity
- Minimizes board and component stress
- Low pressure versus deflection
-
Select options
- 5 W/mK thermal conductivity
- Minimizes board and component stress
- Low pressure versus deflection
