Good thermal conductivity (3.1 w/m-k)
Good softness and is conformable at low pressure ( Shore 00 = 50)
Softness results in low stress on board components
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Good thermal conductivity (3.1 w/m-k)
Good softness and is conformable at low pressure ( Shore 00 = 50)
Softness results in low stress on board components
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Good thermal conductivity (3.1 w/m-k)
Good softness and is conformable at low pressure ( Shore 00 = 50)
Softness results in low stress on board components
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Good thermal conductivity (3.1 w/m-k)
Good softness and is conformable at low pressure ( Shore 00 = 50)
Softness results in low stress on board components
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Good thermal conductivity (3.1 w/m-k)
Good softness and is conformable at low pressure ( Shore 00 = 50)
Softness results in low stress on board components
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Very high thermal conductivity and good electrical insulation properties
Good softness and conformability even to non-flat surfaces
Good electrical insulation properties
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Very high thermal conductivity and good electrical insulation properties
Good softness and conformability even to non-flat surfaces
Good electrical insulation properties
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Very high thermal conductivity and good electrical insulation properties
Good softness and conformability even to non-flat surfaces
Good electrical insulation properties
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Very high thermal conductivity and good electrical insulation properties
Good softness and conformability even to non-flat surfaces
Good electrical insulation properties
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Efficient Heat Transfer
Soft and Conformable
Silicone-Free and Flame Retardant
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Efficient Heat Transfer
Soft and Conformable
Silicone-Free and Flame Retardant
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Efficient Heat Transfer
Soft and Conformable
Silicone-Free and Flame Retardant
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Good thermal stability of the base polymer with the excellent softness of the thermal pad.
Good thermal conductivity in an ultra-soft silicone polymer base.
The product tack is such that a mechanical means to support the pad in a final assembly is required.
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