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Bergquist Sil Pad TSP 1600S – 0.23mm | Henkel
Known as BERGQUIST SIL-PAD 900S
£0.00
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- Efficient Heat Dissipation (1.6 W/m·K)
- Electrical Insulation
- Low Mounting Pressure Compatibility
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Description
The BERGQUIST® SIL PAD® TSP 1600S is a high-performance, silicone-based thermal interface material (TIM) engineered to provide efficient heat transfer and electrical insulation in electronic assemblies. Manufactured by Henkel, this fiberglass-reinforced pad features a smooth and highly compliant surface, ensuring optimal contact between heat-generating components and heat sinks, thereby minimizing thermal resistance and maximizing heat dissipation.
With a thermal conductivity of 1.6 W/m·K, the TSP 1600S is ideal for applications requiring low mounting pressures, such as power supplies, automotive electronics, motor controls, and power semiconductors. Its design accommodates situations where components are secured with spring clips, which apply limited force, making it suitable for discrete semiconductors like TO-220, TO-247, and TO-218 packages.
Benefits
- Efficient Heat Dissipation (1.6 W/m·K)
- Electrical Insulation
- Low Mounting Pressure Compatibility
Features
High Thermal Conductivity (1.6 W/m·K)
- Ensures efficient heat dissipation, preventing component overheating and enhancing device longevity.
Smooth and Highly Compliant Surface
- Minimizes interfacial thermal resistance, optimizing thermal performance even under low-pressure mounting conditions.
Fiberglass Reinforcement
- Provides excellent cut-through resistance, ensuring durability during assembly and operation.
Electrically Isolating
- Prevents electrical shorts, enhancing the safety and reliability of electronic assemblies.
Low Mounting Pressures
- Designed for applications with limited clamping force, suitable for components secured with spring clips.
UL 94 V-0 Flammability Rating
- Meets stringent fire safety standards, making it suitable for various industrial applications.
Recommended Uses
- Power Supplies: Enhances thermal management in power conversion equipment, ensuring reliable performance.
- Automotive Electronics: Provides effective heat dissipation in control units and other automotive electronic components.
- Motor Controls: Improves thermal performance in motor drive systems, contributing to operational efficiency.
- Power Semiconductors: Ideal for discrete semiconductor devices requiring electrical isolation and thermal management.
Physical Properties
| Shore Hardness, ASTM D2240, Shore A | 92 |
| Elongation , 45º to warp and fill, ASTM D412,% | 20 |
| Tensile Strength, ASTM D412, MPa | 9 |
| Flammability Rating, UL 94 | V-0 |
Electrical Properties
| Dielectric Breakdown Voltage , ASTM D149, Vac | 5,500 |
| Dielectric Constant, ASTM D150 @ 1,000 Hz | 6.0 |
| Volume Resistivity, ASTM D257, ohm-meter | 1×10¹° |
Thermal Performance vs. Pressure
| TO-220 Thermal Performance, ºC/W | |
|---|---|
| @ 10 psi | 3.96 |
| @ 25 psi | 3.41 |
| @ 50 psi | 2.9 |
| @ 100 psi | 2.53 |
| @ 200 psi | 2.32 |
| Thermal Impedance, ASTM D5470, ºC-in2 /W | |
|---|---|
| @ 10 psi | 0.95 |
| @ 25 psi | 0.75 |
| @ 50 psi | 0.61 |
| @ 100 psi | 0.47 |
| @ 200 psi | 0.41 |
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