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Bergquist Gap Pad TGP 5000 – 1.524mm | Henkel
10/02/2025Bergquist Gap Pad TGP 5000 – 3.175mm | Henkel
10/02/2025
Bergquist Gap Pad TGP 5000 – 2.032mm | Henkel
Known as BERGQUIST GAP PAD 5000S35 | Silicone
£0.00
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- Thermal Conductivity: 5 W/m-K
- Hardness Shore OO: 35
- Dielectric Constant: 7.5
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Description
The BERGQUIST® GAP PAD® TGP 5000 is a high-performance, silicone-based thermal interface material (TIM) designed to provide efficient heat transfer and electrical insulation in advanced electronic assemblies. Manufactured by Henkel, this soft and highly conformable gap pad ensures optimal contact between heat-generating components and heat sinks, minimizing thermal resistance and maximizing heat dissipation.
With a thermal conductivity of 5.0 W/m·K, the TGP 5000 is ideal for applications requiring low-stress thermal management, such as power electronics, automotive modules, high-performance computing, and telecommunications hardware. Reinforced with fiberglass, it offers excellent puncture, shear, and tear resistance, ensuring durability while maintaining flexibility to fill air gaps. The inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance.
Benefits
- Thermal Conductivity: 5 W/m-K
- Conformable, low hardness
- Electrically isolating
Features
High Thermal Conductivity (5.0 W/m·K)
- Ensures efficient heat dissipation, preventing component overheating and enhancing device longevity.
Ultra-Soft & Highly Conformable
- Adapts to irregular surfaces, effectively filling air gaps and minimizing thermal resistance.
Fiberglass Reinforcement
- Provides puncture, shear, and tear resistance, ensuring durability during assembly and operation.
Natural Inherent Tack on Both Sides
- Eliminates the need for additional adhesive layers, simplifying the assembly process.
Electrical Insulation
- Prevents short circuits, enhancing the safety and reliability of electronic assemblies.
UL 94 V-0 Flammability Rating
- Meets stringent fire safety standards for automotive, industrial, and aerospace applications.
Wide Operating Temperature Range (-60°C to 200°C)
- Functions reliably in harsh environments and extreme conditions.
Recommended Uses
- Power Electronics & Energy Systems: Used in DC/DC converters, inverters, and battery management systems (BMS) for efficient heat management.
- Computing & High-Performance GPUs/CPUs: Provides effective thermal interface solutions for CPUs, GPUs, SSDs, and gaming hardware.
- Telecommunications & 5G Networks: Enhances heat dissipation in RF modules, routers, base stations, and fiber optic equipment.
- Automotive & Electric Vehicles (EVs): Ensures thermal reliability in ECUs, ADAS systems, and power control modules.
- Industrial Equipment & IoT Devices: Prevents overheating in factory automation controllers, robotics, and IoT hardware.
- LED & Lighting Solutions: Helps improve thermal efficiency and lifespan of high-powered LEDs and smart lighting systems.
Physical Properties
| Property | Unit | Value |
|---|---|---|
| Hardness, Thirty second delay value, ASTM D2240, Bulk rubber | Shore 00 | 35 |
| Heat Capacity, ASTM E1269 | J/g-K | 1.0 |
| Density, Bulk rubber, ASTM D792 | g/cc | 3.6 |
| Flammability | UL 94 | V-0 |
| Young's Modulus, ASTM D575 | kPa (psi) | 310 (45) |
Electrical Properties
| Property | Unit | Value |
|---|---|---|
| Dielectric Breakdown Voltage, ASTM D149 | VAC | >5,000 |
| Dielectric Constant, ASTM D150 | 1,000Hz | 7.5 |
| Volume Resistivity, ASTM D257 | ohm-meter | 1×10⁹ |
Thermal Properties
| Property | Unit | Value |
|---|---|---|
| Thermal Conductivity, ASTM D5470 | W/(m-K) | 5 |
| Thermal Impedance, 0.040 inch ASTM D5470: 10% Deflection 20% Deflection 30% Deflection | ºC-in2 /W | 0.41 0.34 0.3 |
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