-
- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 1.5 W/mK
- Requires mounting pressure via spring, metal clip or clamp
Select options
-
- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 1.5 W/mK
- Requires mounting pressure via spring, metal clip or clamp
Select options
-
- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 1.5 W/mK
- Requires mounting pressure via spring, metal clip or clamp
Select options
-
- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 3.0 W/mK
- Requires mounting pressure via spring, metal clip or clamp
Select options
-
- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 3.0 W/mK
- Requires mounting pressure via spring, metal clip or clamp
Select options
-
- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 3.0 W/mK
- Requires mounting pressure via spring, metal clip or clamp
- Adhesive on One Side
Select options
-
- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 3.0 W/mK
- Requires mounting pressure via spring, metal clip or clamp
- Adhesive on One Side
Select options
-
- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 1.5 W/mK
- Requires mounting pressure via spring, metal clip or clamp
- A1 – Adhesive layer on one side
Select options
-
- High dielectric strength and thermal performance
- Thermal conductivity of 6.5W/mK
- Soft and compliant to minimise interfacial thermal resistance but rugged and strong in its application
- No Adhesive
Select options
-
- High dielectric strength and thermal performance
- Thermal conductivity of 6.5W/mK
- Soft and compliant to minimise interfacial thermal resistance but rugged and strong in its application
Select options
-
- High dielectric strength and thermal performance
- Thermal conductivity of 6.5W/mK
- Soft and compliant to minimise interfacial thermal resistance but rugged and strong in its application
- A1 – Adhesive layer on one side
Select options
-
- High dielectric strength and thermal performance
- Thermal conductivity of 6.5W/mK
- Soft and compliant to minimise interfacial thermal resistance but rugged and strong in its application
- A2 – Adhesive layer on both sides.
Select options