Universal Science has an established history in three defined areas of operation; thermal management of electronic assemblies, LED lighting assemblies and EV battery construction expertise. Our 20+ year-long knowledge and understanding of these industries have enabled us to become the global organisation we are today. Established in 2002, our people have over 20 years of thermal management expertise, experience in LED lighting solutions and 10 years of experience in battery pack construction.
10 Results Found
UniGap
Universal Science UniGap is a viscoelastic thermally conductive gap filler ranging from 1.0 W/m-k to 10.0 W/m-k thermal conductivity. UniGap eliminates air voids allowing for more efficient thermal transfer between mating surfaces.
UniGap is a great replacement for your standard thermal greases as it does not pump out and can be handled for precise assembly, some of UniGap' s other qualities include electrical isolation, robust composition and high flexibility.
UniPhase
Universal Science UniPhase is a phase changing thermal interface material, ranging from 0.45 W/m-k to 7.5 W/m-k thermal conductivity. UniPhase eliminates micro-air voids between two mating surfaces with no pump out.
At colder temperatures UniPhase possesses the qualities of a thin pad because of this UniPhase is easy to handle and apply. Once applied and heated past 60°C +/- 10°C it phases into a type of thermal grease making it extremely efficient in thermal transfer.
UniGraph
Universal Science UniGraph is a graphite based thermal interface material ranging from 5.0 W/m-k to 14 W/m-k thermal conductivity. Unlike other thermal interface materials UniGraph has very high thermal conductivity along its plane, allowing for better heat spreading.
UniGraph is very lightweight and thin making it ideal for space-constrained applications as well as being flexible and conformable so even if the surface is uneven you will still have great thermal transfer between the two mating surfaces.
UniFoam
Universal Science UniFoam is a high-strength to weight structural foam, UniFoam has excellent stability at higher processing or service temperatures. UniFoam has a closed cell construction with negligible water absorption.
UniFoam's fine cell structure makes the material ideal for bonding in addition to the material being CFC free.
UniSeal
Universal Science UniSeal is a gasketing foam with qualities such as resistance to UV, ozone, extreme environments and flame resistance. Some UniSeal's are Halogen and CFC free, UniSeal can seal against air, dust, water, etc and can also be used in a variety of industries such as aerospace, automotive and medical.
UniShield
UniShield is a unique part developed in-house by Universal Science, it functions to remove unwanted radio frequency interference (RFI) and unwanted electrical coupling that can often exist between high switching devices and heatsink.
UniShield generally consists of a metal foil such as copper laminated by an electrically isolating thermal pad. The metal foil within the thermal pads acts as a faraday shield to remove RFI, but also doubles as an excellent heat spreader.
T-Pad
Universal Science T-Pad is an electrically insulating thermal interface material ranging from 1.5 W/m-k to 6.5 W/m-k thermal conductivity. T-Pad is a highly durable pad, formulated to thermally connect hot electronic devices to a cold wall or nearby metal work whilst also maintaining electrical insulation.
T-Pad obviates micro air voids for reduced thermal resistance and improved thermal performance making it an excellent choice for TO220, TO247 and more.
T-Cap
T-Cap is an electrically isolating, thermally conductive interface product, providing a complete sheath around the electronic device. T-Cap is intended for use with devices such as TO220, TO247, etc. These devices are entirely encapsulated by the T-Cap and is mounted via a spring clip or clamp for fast and easy assembly.
BondShield
BondShield is an EMI/RFI shielding material utilising a metal foil and thermosetting resin adhesive. BondShield provides excellent adhesion between a variety of substrates delivering a permanent mechanical bond with high dielectric strength.
Some of BondShields other qualities include reflecting heat and being moisture resistant making it ideal for shielding components like motors, cables, cabinets and antennae.
Bondline
Universal Science Bondline is an electrically isolating, acrylic thermal tape. Bondline is designed to mechanically fix and thermally connect electronic devices and PCB's to a heatsink. Bondline is excellent for applications requiring good thermal transfer, dielectric strength and permanent adhesion.
Formulated from acrylic, Bondline is pressure sensitive and the differing thicknesses conform to varying surface textures which fills micro air voids between contact surfaces.
Popular Products
T-Pad 1500™ – A0 – 0.23mm | Universal Science™
SKU: 93449
UniPhase 4000™ COB – 0.25mm | Universal Science™
SKU: 93448
T-Pad 1500™ – A1 – 0.23mm | Universal Science™
SKU: 93450
Bondline 700™ Twin Liner – 0.25mm | Universal Science™
SKU: 93513