Laird improves electronic devices by creating innovative protection solutions. World-leading technology brands rely on Laird for improved protection, higher performance and reliability, custom structural designs, and faster time-to-market. Laird solve design issues through products such as EMI shielding and EMI absorbing materials, thermal interface materials, precision and structural metals, and integrated, multi-functional solutions.
10 Results Found
Tflex
Laird Tflex is a thermally conductive gap filler ranging from 1.2 W/m-k to 10 W/m-k thermal conductivity. Tflex has many different qualities depending on the series, some of which include containing polyimide that provides electrical isolation, high deflection, etc. Tflex also fills air voids allowing for efficient heat transfer between two mating surfaces.
Tgard
Laird TGard is a line of thermally conductive, electrically insulating materials ranging from 0.62 W/m-k to 5.0 W/m-k. TGard usually contains a reinforcement layer such as fiberglass or polyimide making it very durable and reliable.
Tgon
Laird Tgon is a series of graphite based thermal interface materials, these have high thermal conductivity along its plane making it ideal for applications that require good heat spreading and no electrical isolation.
TPCM
Laird TPCM is a series of phase changing thermal interface materials ranging from 1.2 W/m-k to 7.5 W/m-k thermal conductivity. TPCM has many qualities including low thermal resistance, easy handling, negligible pump out, etc.
TPli
Laird TPli is a series of exceptionally soft gap fillers with high compressibility. TPli's exceptional combination of good thermal conductivity and compliancy generate unmatched thermal resistances in gap filling interface materials.
TPli absorbs shock and relieves stresses, thus minimising potential damage to components in addition the material has electrically insulation properties.
TPutty
Laird TPutty is a series of thermal gap fillers varying from solid sheet to liquid formats ranging from 2.3 W/m-k to 9.1 W/m-k thermal conductivity. TPutty demonstrates excellent compression capabilities with low thermal resistance.
Ttape
Laird Ttape is a series of stand-alone pressure sensitive adhesives featuring one of the lowest thermal resistances available on the market. Ttape is designed to facilitate the transfer of thermal energy from heat sources such as IC chips to heatsinks.
Ttape offers a high degree of substrate conformability and adhesion needing only finger pressure to achieve excellent thermal performance eliminating the need for mechanical fasteners or clamping devices.
CoolZorb
Laird CoolZorb is a series of RFI/EMI absorbing thermal gap fillers ranging from 1.7 W/m-k to 11.5 W/m-k thermal conductivity. CoolZorb is an ideal choice for applications requiring good thermal conductivity and RFI/EMI absorbing capabilities.
ElectroSeal
Laird ElectroSeal is a series of electrically conductive elastomers that provide environmental sealing and electromagnetic shielding, making it ideal for applications which require both environmental sealing and electromagnetic shielding and can be used in a wide range of operating temperatures.
Laird ElectroSeal comes with four different fillers based on your needs Nickel and Graphite, Silver and Aluminium, Silver and Glass and Silver and Copper also coming in different elastomer types such as silicone, fluorosilicone and EPDM, making these materials highly versatile depending on your needs.
TMate
Laird TMate is a series of thermal phase change materials with a metal foil reinforcement layer made for easy rework ability. TMate never fully changes state resulting in minimal migration (within operating temperatures).
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