LOADING
5516 Thermal Interface Pad – 2mm | 3M™
29/01/20255516S Thermal Interface Pad – 2mm | 3M™
29/01/2025
5516S Thermal Interface Pad – 1mm | 3M™
Thermally Conductive Silicone Interface Pads
£0.00
To get an instant quote for your custom parts, please select your currency and follow steps 1 to 4.
- Good thermal conductivity (3.1 w/m-k)
- Good softness and is conformable at low pressure ( Shore 00 = 50)
- Softness results in low stress on board components
2 Sheets In Stock
Description
The 3M™ Thermally Conductive Silicone Interface Pad 5516S Series is designed to provide an effective heat transfer path between heat-generating components and heat sinks or other cooling devices. Composed of a conformable and slightly tacky silicone elastomer filled with thermally conductive ceramic particles, this pad ensures enhanced thermal conductivity and excellent electrical insulation. Its softness and conformability allow for low-pressure applications, reducing stress on electronic components. The slight tackiness facilitates pre-assembly, ensuring components remain in place during final assembly. This pad is ideal for applications such as integrated circuit (IC) packaging, heat sinks, LED boards, and general gap filling in electronic devices. Operating effectively within a temperature range of -50°C to 130°C for long-term use, it maintains performance even under varying thermal conditions.
Benefits
- Enhanced Heat Dissipation
- Soft and Conformable
- Easy Handling and Assembly
Features
High Thermal Conductivity
- Filled with thermally conductive ceramic particles, ensuring efficient heat transfer between components and heat sinks.
Soft and Flexible
- Low-hardness silicone material conforms to irregular surfaces, reducing mechanical stress on sensitive electronic components.
Slight Tackiness for Easy Placement
- Naturally tacky surface allows for pre-assembly positioning without additional adhesives, making installation easier.
Excellent Electrical Insulation
- Provides strong dielectric properties, preventing electrical short circuits in high-performance electronic applications.
Wide Operating Temperature Range
- Designed to perform reliably between -50°C and 130°C, making it suitable for demanding thermal environments.
Recommended Uses
- Used to enhance thermal transfer between heat-generating components and heat sinks in electronic devices.
- Applied in LED modules to improve heat dissipation, extending the lifespan and efficiency of lighting systems.
- Provides thermal management in power electronics, ensuring stable performance in high-power applications.
- Used in EV battery packs, inverters, and electronic control units (ECUs) for improved thermal performance.
- Found in laptops, gaming consoles, and mobile devices to manage heat dissipation and prevent overheating.
- Utilized in automation systems, robotics, and high-performance computing for effective thermal regulation.
- Applied in telecom base stations, networking hardware, and data centers to optimize cooling efficiency.
Physical Properties
| Property | Method | Value |
|---|---|---|
| Thermal Conductivity (W/mK) | ASTM D5470 | 3.1 |
| Flammability | UL 94 | V-0 (5516 0.5 mm~ & 5516S 1.01 mm~) |
| Density (g/cm3 , @ 25°C) | - | 2.9 |
| Hardness | Shore 00Note 1 | 5516 @ 50 |
| Volume Resistivity (Ω-cm) | ASTM D257 | 6.9 x 1014 |
| Dielectric Strength (kV/mm) | ASTM D149 | 3.2 |
| Dielectric Constant | ASTM D150 | 11.0 (1-100 kHz) |
Materials Direct
Precision cut technical materials fast
We’re available to assist you for your next project
A division of Universal Science UK
www.universal-science.com
Related products
-
Select optionsBergquist Sil Pad TSP 900 – A1 – 0.18mm | Henkel
£0.00 SKU: 93880- Thermal impedance: 1.13ºC-in2/W @ 50 psi
- Original Sil-Pad material
- Excellent mechanical and physical characteristics
- Adhesive on One Side
-
Select options
UniGap 10000NS™ Gap Pad – 2.75mm | Universal Science™
£0.00 SKU: 94128- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 10.0 W/ mK
- Excellent compressibility
-
Select options
- Highly Conformable
- Heat Conducting Gel Materials
- 13 W/m-k Thermal Conductivity
