Materials Direct can manufacture your custom parts from Bergquist materials quickly and efficiently.
2 Results Found
Gap Pad
Bergquist Gap Pads are a series of thermal gap fillers ranging from 1.0 W/m-k to 5.0 W/m-k thermal conductivity. Bergquist Gap Pads are designed to facilitate thermal transfer between a heat sink and a heat generating component, it achieves this by filling the micro air voids reducing thermal impedance and maximising thermal transfer but also maintaining electrical insulation. Bergquist Gap Pads are ideal for applications requiring good thermal conductivity, electrical insulation and vibration dampening properties.
Sil Pad
Bergquist Sil Pads are a series of soft conformable thermal pads that improve heat dissipation in a range of electronic assemblies.
Bergquist Sil Pads minimise thermal resistance from heat generating component to heat sink while also electrically isolating the heat generating component from the heat sink and providing sufficient dielectric strength to withstand high voltage. Bergquist Sil Pads are designed to maximise thermal performance and be strong enough to resist puncture from the facing surface.
Popular Products
T-Pad 1500™ – A0 – 0.23mm | Universal Science™
SKU: 93449
UniPhase 4000™ COB – 0.25mm | Universal Science™
SKU: 93448
T-Pad 1500™ – A1 – 0.23mm | Universal Science™
SKU: 93450
Bondline 700™ Twin Liner – 0.25mm | Universal Science™
SKU: 93513