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Carp Brand – 1mm | TUFNOL®
27/09/2023
UniGap 8000NS™ Gap Pad – 0.75mm | Universal Science™
13/10/2023
Bergquist Gap Pad TGP 2000 – 3.175mm | Henkel
Known as Gap Pad 2000S40 | Silicone
£0.00
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- Thermal Conductivity: 2.0 W/m-K
- Low “S-Class” thermal resistance at very low pressures
- Highly Conformable, low hardness
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Description
BERGQUIST® GAP PAD® TGP 2000 is a high-performance, silicone-based thermal interface material (TIM) engineered to provide efficient heat transfer and electrical insulation in advanced electronic assemblies. Designed by Henkel, this soft and highly conformable thermal pad ensures optimal contact between heat-generating components and heat sinks, minimizing thermal resistance and maximizing heat dissipation.
With a thermal conductivity of 2.0 W/m·K, the TGP 2000 is ideal for applications requiring low-stress thermal management, such as power electronics, automotive modules, high-performance computing, and telecommunications hardware. Reinforced with fiberglass, it offers excellent puncture, tear, and shear resistance, ensuring durability while maintaining flexibility to fill air gaps.
Benefits
- High Thermal Conductivity (2.0 W/m·K)
- Soft & Conformable
- Electrically Insulating & Durable
Features
High Thermal Conductivity
- Delivers efficient heat transfer with a thermal conductivity of 2.0 W/m·K, ensuring optimal thermal management in electronic assemblies.
Highly Conformable and Low Hardness
- The soft, pliable nature allows the pad to conform to irregular surfaces, filling air gaps and voids to reduce thermal impedance.
Fiberglass Reinforcement
- Provides puncture, shear, and tear resistance, ensuring durability during assembly and operation.
Natural Tack on Both Sides
- Facilitates easy application and rework without the need for additional adhesives, maintaining position during assembly.
Electrical Isolation
- Offers a dielectric breakdown voltage greater than 5,000 VAC, ensuring reliable electrical insulation between components.
Wide Operating Temperature Range
- Performs effectively between -60°C and 200°C, suitable for various environmental conditions.
UL 94 V-0 Compliance
- Meets flammability standards, ensuring safety in electronic applications.
Recommended Uses
- Power Electronics: Ideal for DC/DC converters, including 1/4, 1/2, and full brick configurations, where efficient thermal management is crucial.
- Mass Storage Devices: Enhances heat dissipation in hard drives and solid-state drives, maintaining optimal performance.
- Graphics Cards and Processors: Improves thermal interface between GPUs, CPUs, ASICs, and heat sinks, preventing overheating.
- Telecommunications Hardware: Provides reliable thermal management in wireline and wireless communication devices.
- Automotive Electronics: Manages heat in engine and transmission control units, ensuring reliability under varying temperatures.
Typical Properties
| Property | Imperial Value | Metric Value | Test Method |
|---|---|---|---|
| Color | Gray | Gray | Visual |
| Reinforced Carrier | Fiberglass | Fiberglass | - |
| Thickness (inch) / (mm) | 0.020 to 0.125 | 0.508 to 3.175 | ASTM D374 |
| Inherent Surface Tack (1- or 2-sided) | 2 | 2 | - |
| Density (g/cc) | 2.9 | 2.9 | ASTM D792 |
| Heat Capacity (J/g-K) | 0.6 | 0.6 | ASTM C351 |
| Hardness, Bulk Rubber (Shore 00) (1) | 35 | 35 | ASTM D2240 |
| Young’s Modulus (psi) / (kPa) (2) | 45 | 310 | ASTM D575 |
| Continuous Use Temp (°F) / (°C) | -76 to 392 | -60 to 200 | - |
Electrical Properties
| Property | Imperial Value | Metric Value | Test Method |
|---|---|---|---|
| Dielectric Breakdown Voltage (Vac) | 340 | 13.4 kVac/mm | ASTM D149 |
| Dielectric Constant (1000 Hz) | 6.0 | 6.0 | ASTM D150 |
| Volume Resistivity (Ohm-meter) | 4.2 x (10x11) | 4.2 x (10x11) | ASTM D257 |
| Flame Rating | V-0 | V-0 | UL |
Thermal Properties
| Property | Imperial Value | Metric Value | Test Method |
|---|---|---|---|
| Thermal Conductivity (W/m-K) | 2.0 | 2.0 | ASTM D5470 |
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